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1.Gold Plated PI film
2.Gold Plated Conductive Fabric
3.Gold Plated Copper Foil
4.5G Nano Fiber Antenna Material
5.Conductive Liquid Crystal Polymer N.W-F.R. Solder able
6.High Density /High Conductivity N.W.
7.Supper Thin T0.02mm Absorber
5B level bonding strength, 180°Bending：>10 cycles, no crackle on coating layer.
Supper thick gold coating, S.R. < 0.05Ω/Sq. Salt spray test ：24 Hrs.
base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.
T 10-100µ, Width Max. 540mm.
upper thick gold coating, S.R. < 0.05Ω/Sq. Salt spray test ：24 Hrs.
base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.
1.Gold Plated PI film
2.Gold Plated Copper Foil
3.Gold Plated Conductive Fabric4.Gold Plated LCP Nonwoven/F.R, Sold able with Heat Resistance > 300°C
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